August 25, 2004... BOSTON, Mass. USA -- Color Kinetics Incorporated (Nasdaq: CLRK), a pioneer in the design, marketing and licensing of intelligent solid-state lighting systems and technologies, today announced the issuance of a US patent Relating to a miniaturized, integrated, intelligent solid-state string light, respective individual LED nodes in a string configuration have the capability to be independently controlled.
Issued on August 17, 2004, US patent number 6,777,891 relates to part to technology that is implemented in Chromasic(TM), the companys proprietary integrated circuit that allows a reduction in the cost, size, weight, and complexity of systems One commercial, multi-purpose, intelligent solid-state string light comprised of individually controllable tri-color LED nodes. By refining control Down to the singular LED level, this technology enables complex and intricately designed effects that may span many thousands of nodes -- making previously unattainable or cost-prohibitive lighting designs possible.
This latest US patent covers groundbreaking technology that opens up completely new applications of intelligent solid-state lighting, including the generation of animated effects and video-driven light shows, said Dr. Ihor Lys, CTO of Color Kinetics and one of the patents named inventors The coverage of this invention brings exciting potential for further product development and OEM and licensing opportunities.
Products that leverage this proprietary technology are used in a wide variety of applications today, including the lighting of exterior facades, stage and television sets, hospitality venues, and exhibits and displays. For example, the technology powers Soft-LED(TM), a Light drapery for entertainment applications developed by Main Light Industries, a Color Kinetics OEM customer.
Color Kinetics now holds 32 issued patents and has more than 120 patent applications pending that range from core technology and products to high-level control systems, complete lighting systems, applications and methods of use.
About Color Kinetics
Color Kinetics Incorporated (Nasdaq: CLRK - News) is a pioneer in the design, marketing and licensing of intelligent solid-state lighting systems and technologies. The companys award-winning line of products applies the practical and aesthetic benefits of LEDs to transcend the limits Of traditional light sources for use in high-performance lighting and OEM and licensing applications. Its products and technologies leverage a patented layer of digital intelligence, called Chromacore?, to generate and control millions of colors and dynamic lighting effects. Color Kinetics holds 32 patents And has over 120 patent applications pending that apply to many aspects of solid-state lighting technology. Founded in 1997, the company is headquartered in Boston, MA with offices in the UK, China, and a joint venture in Japan. More information can be Found at http://
All rights reserved. Chromacore, Color Kinetics, the Color Kinetics logo, ColorBlast, ColorBlaze, ColorBurst, ColorPlay, ColorScape, Direct Light, iColor, iColor Cove, iPlayer, QuickPlay, Sauce, the Sauce logo, and Smartjuice are registered trademarks and Chromasic, ColorCast, Direct Light Player, Optibin, and Powercore are trademarks of Color Kinetics Incorporated. All other trademarks mentioned are the property of their respective owners.
Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995: Statements in this press release regarding Color Kinetics Incorporateds business that are not historical facts are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Readers are cautioned that These statements involved risks and uncertainties, are only predictions and may differ materially from actual future events and results. For a discussion of such risks and uncertainties, see Risk Factors in the Companys Registration Statement on Form S-1, File Number 333-114386, And in its Quarterly Report on Form 10-Q for the Three Months Ended September 30, 2004, each as filed with the Securities and Exchange Commission.
HDI Pcb
Hdi Pcb Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
Key HDI PCB Benefits
The evolution of high density PCB technology has given engineers greater design freedom and flexibility than ever before. Designers now have the ability to place more components on both sides of the raw PCB if desired. In essence, an HDI PCB gives designers more space to work with, while allowing them to place smaller components even closer together. This ultimately results in faster signal transmission along with enhanced signal quality.
HDI PCB is widely used to reduce the weight and overall dimensions of products, as well as enhancing the electrical performance of the device. It's regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices as well as various electronic aircraft parts and components.
High Density PCBs of Impeccable Quality
Over the course of a decade in business, Topscom has established a hard-earned reputation for manufacturing PCBs of the highest quality. Our custom PCB manufacturing capabilities enable you to get the finest quality HDI PCBs at competitive prices without min order quantity requirement. Our team run design for manufacture check on your custom PCB file and consult with you to ensure it is ready for manufacturing and that your boards will meet your performance requirements. We also have an on-site quality control department to verify the finished product meet your high quality standards.
HDI Structures |
Type of Micro vias |
Mass Production |
Small-Middle Batch |
Prototype | Available |
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 |
Blind/Buried staggered vias |
Yes | Yes | Yes | 6 layers+ |
2+N+2 |
Blind/Buried stacked vias |
Yes | Yes | Yes | 6 layers+ |
3+N+3 |
Blind/Buried staggered vias |
/ | Yes | Yes | 8 layers+ |
3+N+3 |
Blind/Buried stacked vias |
/ | / | Yes | 8 layers+ |
Check our HDI PCB capabilities by reviewing the table found below:
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 4 - 24layers |
Order Quantity | 1pc - 10000+pcs |
Build Time | 2days - 5weeks |
Material | FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination |
Board Size | Min 6*6mm | Max 457*610mm |
Board Thickness | 0.4mm - 3.0mm |
Copper Weight (Finished) | 0.5oz - 2.0oz |
Min Tracing/Spacing | 2.5mil/2.5mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finish |
HASL - Hot Air Solder Leveling Lead Free HASL - RoHS ENIG - Electroless Nickle/Immersion Gold - RoHS Immersion Silver - RoHS Immersion Tin - RoHS OSP - Organic Solderability Preservatives - RoHS |
Min Annular Ring | 4mil, 3mil - laser drill |
Min Drilling Hole Diameter | 6mil, 4mil - laser drill |
Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
Other Techniques |
Flex-rigid combination Via In Pad Buried Capacitor (only for Prototype PCB total area ≤1m²) |
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