STMicroelectronics Launches Ultra-Low Power SOI Chip for Medical Devices

STMicroelectronics has announced that the company has verified an ultra-low-power chip production process that was jointly developed by the European Smart Power Management in Home and Health (SmartPM) alliance and is planned for medical devices and hybrid and electric vehicles. Charging.

SmartPM is a consortium within the framework of the European Electronic Action Advisory Committee. It consists of STMicroelectronics and 17 European cooperatives. Seventeen groups come from companies and academic institutions in Belgium, France, Germany, Ireland, Italy, the Netherlands, Norway, Spain, and Sweden.

This time it was used to verify the use of SOI substrate material and BCD (bipolar-CMOS-DMOS) process, using 0.16μm exposure technology. Using this process, high-density logic circuits (1.8V and 3.3V CMOS) with fully isolated insulation layers, power MOSFET transistors with a maximum withstand voltage of 300V, low noise components, and high-resistance registers can be integrated on one chip.

The verification chip is developed by STMicroelectronics in cooperation with the world's top medical device manufacturers and is a chip for ultrasonic scanners. The chip can handle more than 100 channels of signal processing. With this chip, a new generation of ultrasonic scanners with thousands of channels can be realized.