Reading a variety of passive devices based on IPD technology

Core Technologies is a leading supplier of EDA software, integrated passive device IPD and system-in-package SiP. The company is committed to providing differentiated software products and chip miniaturization solutions for semiconductor chip design companies and system manufacturers, including high-speed digital design, IC package design, and RF analog mixed-signal design. These products and solutions are widely used in smart phones, Internet of Things, artificial intelligence, wearable devices and other fields.

Application of IPD in Mibo

In Mibo applications, the wavelength of the ~GHz band in RF applications is much larger than that of the RF applications, resulting in the large size of the IF passive components. In the ~100MHz band, passive devices using distributed circuit designs are often difficult to apply due to their large size in many applications. For meters, such as broadcasting, sub-1GHz, clock distribution circuits, and heterodyne IF circuits, traditional designs use distributed circuit designs or discrete surface-mount devices to build circuits, while IPD (integrated passive device) technologies are used for these applications. A scheme that can greatly reduce the size of passive devices is provided.

Core Technology provides all kinds of passive devices based on IPD technology, including filters, duplexers, baluns, couplers, power splitters, attenuators, etc., supporting a variety of packages such as LGA, gold wire bonding, inverted Assembly and wafer-level chip packages. This section describes various passive devices based on IPD technology in the ~100MHz band.

A typical IPD-based low-pass filter performance curve is shown below.

A typical IPD-based bandpass filter performance curve is shown below.

A typical balun performance curve based on IPD technology is shown below.

A typical IPD-based power divider performance curve is shown below.

A typical 90° bridge performance curve based on IPD technology is shown below.

In the mid-frequency applications, IPD chips have a variety of connection forms. In addition to being integrated into a silicon in a system in package (SiP) module, an IPD chip can also be packaged into a printed circuit board (PCB) through LGA or other forms. ) Surface mount devices that can be applied directly.