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National Semiconductor announced the company's new Boomer® 1.3W mono Class AB audio amplifier that adds hands-free listening and ringing to mobile phones in the world's smallest micro SMD package.The LM4995 amplifier is available in a micro SMD package measuring just 1.25mm x 1.25mm and a pitch of 0.4mm, making it ideal for small, slim electronic products. Because the new package is extremely compact, it occupies 30% less board space than existing audio amplifiers, so engineers can easily lay out circuit boards even in confined spaces.
The LM4995 requires only a single 5V supply to continuously deliver an average of 1.3W of output power to drive an 8W speaker load and ensure total harmonic distortion and noise levels of less than 1%. The power supply rejection ratio (PSRR) of the LM4995 chip is as high as 74dB at 217Hz. In addition, the chip's quiescent current is as low as 1.6mA, which helps extend the battery life of portable electronics.
Systems using the LM4995 do not require a startup capacitor or buffer snubber circuit, which helps reduce the number of external components and the size of the system. In addition to the low-power shutdown mode and internal thermal shutdown protection, this amplifier chip also features an advanced switching/switching noise suppression circuit, which eliminates the output transient noise that often occurs during switching. The LM4995 has high unity gain stability and can be configured externally with a simple gain setting resistor.
Innovative and advanced integrated circuit packaging technology
In 1999, National Semiconductor was the first to introduce an advanced micro SMD package. Since then, the company's chip factory in Santa Clara, Calif., and the assembly plant in Malacca, Malaysia have been working on a cross-regional basis, and have finally succeeded in developing a new generation of micro SMD packages with a pitch of only 0.4 mm. This new package is manufactured using advanced processes including wafer production, block bonding and back grinding. This package is supported even by conventional surface mount chip pick-up devices.
National Semiconductor produces billions of chips a year and uses more than 70 packages. Based on packaging technology alone, the company has more than 290 patents registered, and an average of 30 new patents are obtained each year. National Semiconductor is the first to introduce a variety of innovative packaging technologies, including micro SMD and LLP® packaging technologies.
Price and availability
The LM4995 is available in a lead-free, 9-bump micro SMD package and is priced at $0.65 each in 1,000-unit quantities.
Overhead Conductor Co., Ltd. , http://www.nspowercable.com