Molex's new high-speed, low-loss flexible circuit assembly with DuPont Pyralux TK flexible circuit materials

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Molex introduces a new high-speed, low-loss flexible circuit assembly made from DuPontTM Pyralux® TK flexible circuit materials. This component is ideal for electronic data transfer applications such as servers and high-end computing, storage servers, and signal processing.

Glex Kuchuris, Molex Marketing Manager, said: "The routing of signals in tightly packed data communications, telecommunications, aerospace and defense equipment is extremely challenging. Advanced materials are in the process of increasing the demand for data transmission to drive system losses. More critical. Our high-speed, low-loss flexible circuit components use DuPont's Circuit and Packaging Materials division and Molex's state-of-the-art technology to deliver unique, high-performance solutions for signal and high-frequency flexible circuit applications. Excellent signal integrity."

Molex is one of the first manufacturers to adopt this practice in the integration of DuPontTM Pyralux® TK flexible circuit materials into the mass production of multilayer flexible circuit construction. Pyralux® TK is a double-sided flexible copper foil laminate and bond system formulated with DuPontTM Teflon® fluoropolymer film and DuPontTM Kapton® polyimide film. The system has excellent electrical performance for high speed signal and high frequency flexible circuit applications. Compared to standard flexible components, Pyralux® TK offers superior dielectric constant and low loss performance for a mechanically flexible construction with a smaller bend radius and faster transfer speeds.

Prasanna Srinivasan, Head of Market Development at DuPont's Circuits and Packaging Materials Division, said: "Molex has worked closely with DuPont to bring PyraluxTM TK into mass-produced new Molex high-speed, low-loss flexible circuit assemblies for superior results. Signal loss can be minimized to increase speed and design flexibility."

Molex high-speed, low-loss flexible circuit assemblies are available in self-rolling or mechanically-assisted winding versions for flexible 3D packaging, minimizing insertion loss and improving airflow compared to standard printed circuit board designs.

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