How to use RF reference module to accelerate OEM product design and implementation

Although the speed of popularization and development of wireless technology continues to lead the speed of most related engineering elements, by purchasing off-the-shelf radio frequency chips and connecting them with antennas, it still cannot enable OEMs to achieve a complete design. Factors such as impedance matching and PCB layout optimization pose daunting challenges to RF design. Wireless IC manufacturers have invested a lot of time and money in the chip development process at the silicon level to solve various design challenges. However, there is still considerable distance from a well-designed RFIC to its successful integration into OEM products. Therefore, RF reference modules came into being, which provided convenience for OEMs to design applications around chips.

Preliminary test

Before making a decision to invest heavily in R & D funding and time for an RF chip, the first step the OEM wants to do is to evaluate the RFIC's performance. The RF reference module provides such a platform, which is generally used in conjunction with development or evaluation kits with the required firmware. The module can be used for indoor or outdoor coverage distance testing. With this module, the OEM can get a general understanding of the actual performance of the RF chip.

Figure 1: CY3630M reference module with PCB trace antenna
Figure 1: CY3630M reference module with PCB trace antenna

Because wireless IC manufacturers invest considerable time and resources in optimizing reference modules, product developers need to evaluate only the benchmark performance of RF mapping. This move circumvents the risk that the OEM will proceed with the design based on this chip based on the data sheet specifications rather than the actual performance. As a result, the return on investment (ROI) risk is significantly reduced.

Detailed test

When the antenna is replaced with an SMA or miniature coaxial connector (see Figure 2), another way of implementing the RF reference module is possible. This process simplifies the implementation of conducted RF measurements up to the antenna circuit link. This module also makes it possible to further study the matching network of the link behind the RF pin, and use the network analyzer to measure the return loss and impedance. This move enables OEMs to modify the matching network based on the antenna they plan to use. Conducted measurements such as peak RF output power at different power amplifier levels can be made with the help of a spectrum analyzer or power meter. You can also measure spurious harmonics in the frequency band of interest. The frequency band occupied by the transmitter and the conducted spurs of the receiver can be measured and detected to determine whether they meet the wireless control regulations.

Figure 2: Reference module with SMA
Figure 2: Reference module with SMA

PCB layout and schematic design points

The RF reference module provides a typical application circuit schematic diagram using the RF chip and an optimized PCB layout that meets the module specifications. Because chip manufacturers provide sufficient resources for RF layout engineers to let them modify and optimize PCBs in order to ensure the best performance, RF chip manufacturers have fixed some of the errors that OEMs may make during layout. These possible errors include: (a) if the sideband noise can be introduced, the crystal is placed under the RF output matching circuit, and the device is incorrectly placed; (b) the fragmented ground potential can reduce the receiver performance by several dB. "Island"; (c) Arrange mechanical components like screws in its vicinity, this approach is easy to detune the antenna; (d) Enclosed wiring errors that can lead to ESD failure.

The PCB trace width of the reference module takes into account the requirements of different signals (such as power lines and transmit output transmit lines, etc.). In addition, manufacturers generally lead important IC pins to the terminal block or test point to facilitate test and measurement. If the OEM intends to use the external power amplifier to increase the transmission power to expand the coverage, the reference module can provide several pins to drive the power amplifier and use an external RX-TX RF switch. What is recommended in the design is the power supply decoupling capacitor value. Another significant benefit of using a reference module is that if the manufacturer uses a PCB wire antenna, then you have a working antenna design that saves you the trouble of simulating and testing various other antenna topologies. With the help of the reference module, you can easily estimate the number of PCB layers and PCB thickness required for your design.

Raw material cost estimation and FCC certification

For low-cost applications, the number of peripheral devices required by the RFIC often determines the trade-off between two RF chips with the same RF data specifications. With the help of the RF reference module, it is possible to accurately estimate the required raw materials and the approximate cost of building the OEM's own module. Manufacturers generally choose discrete devices that can be easily purchased from distributors.

Some RF IC manufacturers' RF reference modules have been pre-certified by the FCC. These RF reference modules have passed several FCC tests, such as: spurious emission test, output power and occupied bandwidth test. Pre-certification circumvents a major bottleneck faced by product developers, especially when the schematics and layouts are different from the original RF reference module.

Summary of this article

The RF reference module enables OEMs to immediately evaluate the RF chip, accurately estimate and analyze the cost of raw materials required for their application, and have fully tested design schematics and layout guidance. OEMs can copy the layout and schematics of the reference modules as they are or use them as hands-on tools so they do n’t have to start from scratch. This speeds up the time to market of its products, which in turn increases its return on investment. For wireless IC manufacturers, the rapid realization of their RF chips can enable them to win important design contracts in the short term and bring higher profits. Therefore, the RF reference module forms a win-win symbiosis between RF chip manufacturers and OEMs.

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