Cob light source

Cob light source is already a common product category in lighting products. There are many brands that produce cob light source, but many people still don't understand the meaning of cob light source. Today, Xiaobian will talk about this knowledge for everyone.

COB: is the abbreviation of Chip on Board English, which means chip-on-board packaging technology, which can be simply understood as: multiple LED chips integrated with illuminators packaged on the same substrate.

COB integrated packaging is a relatively mature LED packaging method. With the wide application of LED products in the field of lighting, COB surface light source has become one of the mainstream products in the packaging industry.

Cob light source

The COB light source is a high-efficiency integrated surface light source technology in which the LED chip is directly attached to a high-reflection mirror metal substrate. This technology eliminates the bracket concept, electroless plating, no reflow soldering, and no patching process, so the process is reduced by nearly three points. One of them, the cost is also saved by one third.

The COB light source can be simply understood as a high-power integrated surface light source, and the light-emitting area and external dimensions of the light source can be designed according to the product outline structure.

Features:

Cheap and convenient

Electrically stable, circuit design, optical design, heat dissipation design is scientific and reasonable;

The use of heat sink process technology ensures that the LED has an industry-leading heat lumen maintenance rate (95%).

It is convenient for secondary optical matching of products and improves lighting quality. ;

High color, uniform light, no spot, healthy and environmentally friendly.

The installation is simple, the use is convenient, the design difficulty of the lamp is reduced, and the processing of the lamp and the subsequent maintenance cost are saved.

main products

There are two main types of bare chip technology: one is COB technology and the other is flip chip technology (Flip Chip). On-board chip package (COB), the semiconductor chip is placed on the printed circuit board, and the electrical connection between the chip and the substrate is realized by a wire stitching method and covered with a resin to ensure reliability.

Cob light source

The main application of COB light source

The main indoors are: spotlights, downlights, ceiling lights, ceiling lamps, fluorescent lamps and light strips.

Outdoor street lights, high bay lights, floodlights and wall lights at night in the city, luminous characters, etc.

COB light source manufacturing process

The COB Chip On Board (COB) process first covers the wafer placement point with a thermally conductive epoxy resin (usually an epoxy resin doped with silver particles) on the surface of the substrate, and then places the silicon wafer directly on the surface of the substrate. The heat treatment is performed until the silicon wafer is firmly fixed to the substrate, and then the electrical connection is directly established between the silicon wafer and the substrate by wire bonding.

Advantages of COB:

In terms of cost, compared with discrete light source devices, COB light source modules can save device package cost, light engine module fabrication cost and secondary light distribution cost in lighting applications. In the same function of the lighting system, the overall cost can be reduced by about 15%. In terms of performance, by reasonably designing and molding microlenses, the COB light source module can effectively avoid the disadvantages such as spot guns and glare in the combination of discrete light source devices, and can also reduce the efficiency and life of the light source by adding appropriate red chip combinations. Under the premise, effectively improve the color rendering of the light source (currently can achieve more than 90).

In application, the COB light source block can make the installation and production of the lighting fixture factory simpler and more convenient. In production, existing process technologies and equipment can fully support the high-volume production of high-yield COB light source modules.

The new fourth-generation light source of COB planar light source can also be said to be the evolution of the fourth-generation light source because its illuminator is a chip light-emitting diode. But the difference between the two is the packaging technology. The fifth-generation light source adopts the most advanced high-tech packaging technology in the world, and the ordinary light-emitting diode is packaged in a small plane, so it is called a surface light source.

Compared with the point source, in the case of the same wattage, the area of ​​the surface area of ​​the surface light source is reduced by more than 10 times than that of the point source, and the heat generated is reduced by 5-10 times, which greatly reduces the energy consumption. And the problem of light source exhaustion due to heat dissipation problems, and make the assembled lamp housing lighter and more compact. The illuminating angle and effect of the surface light source are better played and applied under the refraction and concentrating of the lens, so that the illuminating angle can be arbitrarily adjusted, so that secondary light distribution can be formed. However, since the point light source is too large in the light-emitting area, the lens is difficult to use, and the light-emitting angle becomes a "dead angle".

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