According to the IEK ITIS plan of ITRI, the overall IC industry output value (including design, manufacture, packaging, and testing) in Taiwan in the third quarter of 2011 reached NT$377.7 billion, a 6.0% decline from the second quarter of 2011. The biggest reasons are (1) the Greek crisis is still pending, and the demand for electronic products in Europe and the United States will be impacted; (2) The demand for PC/NB and feature phones has already experienced a structural decline. Among them, the IC manufacturing industry experienced the largest decline (10.6% in the quarterly decline), especially DRAM (24.4% in the quarterly decline).
First of all, we observed the IC design industry. Although Taiwanese companies are exploiting the market of 2G/3G mobile phones and digital televisions in mainland China, their revenue growth is not weak. However, due to the global PC/NB demand still no improvement, coupled with the non-Apple camp smart phones and tablet PCs and other shipment performance as expected, making the domestic and LCD panel driver and control IC, power management IC, memory control IC And other related businesses, revenue declined significantly. Overall, in the third quarter of 2011, Taiwan's IC design industry did not perform well during the peak season with a production value of NT$97.9 billion, a decline of 1.6% from the second quarter of 2011.
In terms of IC manufacturing, Taiwan's overall IC manufacturing output declined by 10.6% in the third quarter of 2011 from the second quarter to NT$187.9 billion, a sharp decline of 22.6% from the same period last year. In the wafer generation industry, it declined by 5.0% from the second quarter and 7.5% from the same period last year. Affected by the impact of US debt and European debt on global consumer confidence, end-user demand weakened, and customers continued to invent inventory, making Taiwan's wafer foundry season not booming in the third quarter. In terms of its own products (including Memory and IDM), it was down 24.4% from the second quarter and a sharp drop of 48.8% from the same period of last year. DRAM companies are affected by business transformation, process conversions, and financial turnover. The combination of revenue and sales has been suppressed, coupled with the further decline in the global DRAM product ASP has also impacted Taiwan's Memory production performance.
Finally, in the IC packaging and testing industry, although the mobile and tablet PC application chips continued to grow in the third quarter of 2011, the growth rate was lower than previously expected. Taiwan's packaging and testing industry has faced multiple factors such as inventory adjustments, ongoing revisions by upstream customers, depreciation of DRAM production plus the depreciation of the US dollar, rising gold prices, and potential shortfalls in China and Taiwan. Loss of growth momentum in the "peak season". In the third quarter of 2011, the output value of Taiwan's packaging was NT$62.8 billion, a slight decline of 0.3% from the second quarter; the output value of the testing industry was NT$28.1 billion, a slight decline of 0.7% from the second quarter.
First of all, we observed the IC design industry. Although Taiwanese companies are exploiting the market of 2G/3G mobile phones and digital televisions in mainland China, their revenue growth is not weak. However, due to the global PC/NB demand still no improvement, coupled with the non-Apple camp smart phones and tablet PCs and other shipment performance as expected, making the domestic and LCD panel driver and control IC, power management IC, memory control IC And other related businesses, revenue declined significantly. Overall, in the third quarter of 2011, Taiwan's IC design industry did not perform well during the peak season with a production value of NT$97.9 billion, a decline of 1.6% from the second quarter of 2011.
In terms of IC manufacturing, Taiwan's overall IC manufacturing output declined by 10.6% in the third quarter of 2011 from the second quarter to NT$187.9 billion, a sharp decline of 22.6% from the same period last year. In the wafer generation industry, it declined by 5.0% from the second quarter and 7.5% from the same period last year. Affected by the impact of US debt and European debt on global consumer confidence, end-user demand weakened, and customers continued to invent inventory, making Taiwan's wafer foundry season not booming in the third quarter. In terms of its own products (including Memory and IDM), it was down 24.4% from the second quarter and a sharp drop of 48.8% from the same period of last year. DRAM companies are affected by business transformation, process conversions, and financial turnover. The combination of revenue and sales has been suppressed, coupled with the further decline in the global DRAM product ASP has also impacted Taiwan's Memory production performance.
Finally, in the IC packaging and testing industry, although the mobile and tablet PC application chips continued to grow in the third quarter of 2011, the growth rate was lower than previously expected. Taiwan's packaging and testing industry has faced multiple factors such as inventory adjustments, ongoing revisions by upstream customers, depreciation of DRAM production plus the depreciation of the US dollar, rising gold prices, and potential shortfalls in China and Taiwan. Loss of growth momentum in the "peak season". In the third quarter of 2011, the output value of Taiwan's packaging was NT$62.8 billion, a slight decline of 0.3% from the second quarter; the output value of the testing industry was NT$28.1 billion, a slight decline of 0.7% from the second quarter.
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